The Nexus soldering system guarantees the best results with a reflow soldering process using contact heat in a vacuum. This enables you to meet the highest requirements in the field of advanced packaging and power electronics. Productivity increases and quality advantages are achieved in the manufacturing of these components like this. In this way, the vacuum ensures oxide-free processes, as well as improved wetting and thus better filling of soldered joints. In addition, the vacuum drastically reduces the voids in soldered joints and enables processes such as plasma cleaning and atmosphere exchange for advanced packaging. Temperatures of up to 400°C can be used as standard.